Because in semiconductors, 'almost perfect' isn't good enough.

 

In semiconductor manufacturing, precision is everything. As wafer structures become smaller and production lines run faster, other imaging systems often reach their limits. Detecting macro defects (> 1 µm) across large wafers, at high speed and with the right lighting, has become one of the biggest challenges in quality assurance.

Your Challenges

Detecting tiny defects across large wafers

In wafer inspection, even the smallest particles or scratches must be reliably detected. At the same time, inspection needs to cover full 300 mm wafers – requiring high resolution across a large field of view.

Maintaining high speed for 100% inspection

Complete surface inspection must happen within tight cycle times. Slower inspection increases the risk of production bottlenecks and reduced throughput.

Adapting illumination to different defect types and surfaces

Different types of defects require different lighting techniques and colors to be clearly visible – all while maintaining sufficient light intensity for high-speed scanning.

Our Solution

High-resolution line scan cameras up to 32k

Capture high-resolution images – with fewer cameras for the same field of view. This reduces cost and integration effort while detecting even the smallest defects.

Sharp results – even at high speeds

With perfectly synchronized line scan cameras, the entire wafer is captured in a single pass – enabling fast and high-qualitative inspection

Flexible, high-intensity illumination

Lighting systems with different characteristics and LED colors ensure optimal contrast for various defect types – even at high speeds.

Application Examples: Flexible inspection – across all wafer processing steps.

From bare wafer to final shipment, visual inspection is essential at every stage. These are typical application areas where high-resolution imaging and adaptable lighting make the difference.

1. Bare Wafer Inspection Inspection of unprocessed wafers to detect particles, surface scratches or contamination before any structuring begins.

2. Backside Wafer Inspection Quality control of the wafer’s reverse side – important before processing or for double-sided wafers.

3. Macro Defect Detection Detection of large-area defects such as coating irregularities, bad contacts, bridging, or missing structures.

4. Etch Process Monitoring Inspection after the etching step to identify residues, corrosion, pinholes, or pattern defects.

5. CMP (Chemical Mechanical Polishing) Inspection Surface quality control after polishing – checking for scratches, residues or unpolished areas.

6. Outgoing Quality Control (OQC) Final visual check before wafers leave the fab – ensures cleanliness, coating integrity, and surface quality.

With 20+ years of semiconductor expertise and our cutting-edge linescan technology – we’ve proven to be a trusted partner when it comes to pushing the limits in wafer inspection.

Klaus Riemer, Project Manager Chromasens

Our Recommendation: allPIXA evo 16k & 32k + Corona II Combined light

allPIXA evo 16k & 32k – High-performance line scan cameras for wafer inspection

The allPIXA evo 16k and 32k combine high resolution and high speed to meet the demands of modern wafer inspection. With up to 16k for multi-field imaging and 32k for ultra-wide fields of view, both models deliver precise results at high throughput.

Multi-field functionality enables image capture under different lighting conditions (e.g. brightfield and darkfield) in a single scan. Thanks to high line rates and CoaXPress interface, both cameras support fast, reliable inspection with reduced system complexity.

Whether for bare wafer inspection, CMP surface checks or macro defect detection – the allPIXA evo series ensures high-quality imaging across all critical process steps.

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Corona II Combined light Dark field, Bright field and Coaxial light

The Corona II light modules with patented mirror technology and smart diffusors provide very homogeneous and bright light even on reflective surfaces – available as dark field, bright field and coaxial variants.

To make different types of defects visible, up to three light modules can be combined in one camera system, resulting in contrast-rich images at high-speeds. With synchronized camera-lighting-control and flexible cooling options, it’s easy to integrate into any line scan setup.

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TKH Vision is a collaborative Group of specialized machine vision technology brands, backed by solid resources and a shared dedication to excellence — ensuring reliable, high-quality solutions for demanding industrial applications.

Chromasens, as part of this group, specializes in advanced 2D/3D line scan technology and lighting systems

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Our experts are happy to help you find the perfect camera for your requirements.

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