BGA Inspection
Application Challenges
- High precision measurement of 3D shape and height of each single BGA
- Substrate surface contamination and defect detection
- 100% Inline inspection
- Fastest speed, high production throughput
3D Solution
- 3DPIXA dual
- Combined illumination: diffuse tube light + bright field + dark field
- GPU accelerated high speed 3D data reconstruction
- High precision measurement
- Scalable large FOV from 35 to 150mm
- High dynamic range
- BGA height and shape measurement
- Bright field + dark field illumination based substrate surface inspection
- Little occlusion compared to laser triangulation
| Camera | Res/Pixel | FOV | Max. Speed | Illumination | Controller | Others (SW, accessories) |
|
3DPIXA dual HR 5µm |
5 µm |
35 mm |
148 mm/s |
Tube Light CP000200-170T-04-2.5BNL CP000606... |
XLC4-1A LED Controller CP000411-1A |
CS 3D API / Dongle |
|
3DPIXA wave compact 8µm |
8 µm |
36 mm |
147 mm/s |
|||
|
3DPIXA wave dual 10µm |
10 µm |
150 mm |
184 mm/s |