Capturing yield limiting defects is crucial for semiconductor wafer devices yield. Here we describe how semiconductor wafer manufacturing can take advantage of its ultra-high resolution 15,360 pixels and rich features to advantage of in-line inspection systems allPIXA wave Trilinear color and mono TDI line scan camera.
The white paper gives a general overview as well as to function as a reference for all tasks related to synchronizing allPIXA classic, allPIXA pro and allPIXA wave cameras.
This white paper gives a comprehensive overview on the limitations of the block-matching approach in height reconstruction for passive stereoscopy. It describes a variety of different artefacts that appear at certain image features.