Case Studies

3DPIXA wave for BGA inspection

In the electronics and semiconductor industry soldering connections using BGAs (Ball Grid Arrays) are widespread. Most prominent examples are the mounting of microprocessors.The only way to ensure this is a one hundred percent inspection, where each solder ball must be measured three-dimensionally.

Analyzing textures in fiber technology

Online testing of fibers can be a challenge for measurement technology providers. Together with industrial partners, the staff of the Fraunhofer IGCV has succeeded in reliably detecting fiber defects in production. Within the current project AirCarbon III, the Fraunhofer IGCV conducts research with AI in fiber technology.

Connector pin inspection

This report isan example how to use a 3DPixa and the 3DAPI to implement a measuring task for connectors.

3D line scan camera - 3DPIXA for testing connectors

Connectors are indispensable in electronics. For a long time now, they can only be economically produced on fully automated production lines with an integrated 100% quality check. Eberhard AG achieves this quality goal by switching to a one-step contactless test method with 3D line scan cameras.

3D image capturing system for on-track train inspection

3D image capturing system for on-track train inspection. Setting the direction. In view of ever more complex railway networks and increasingly shorter cycles, the assurance of a fault-free function of railway vehicles is the highest priority of railway operators. The implementation of new measuring methods such as high-precision 3D image capturing systems offers new strategies for innovative maintenance concepts.