Inspecting wire bonding processes inline is currently one of the most challenging tasks in machine vision. Traditional inspection is performed on 2D images, color or grayscale, and consists for instance of wire tracing, Bent and broken wire detection, Wire solder spot / wedge analysis, Wire attendance check. 2D inspection is insufficient for some tasks and 3D information is required.
The procedure for measuring camera repeatability is described and illustrated by example of a 15µm 3DPIXA camera module. It is elaborated how to distinguish repeatability of the camera, and repeatability of the entire scanning system. Practical information is given regarding how to analyze scan data and how to account for measurement bias.
The light factor is often neglected when discussing high performance image processing systems. Every brilliant image requires two things: an excellent camera and excellent lighting. The following article offers good advice for the selection of an optimal lighting solution and important practical tips.