In the electronics and semiconductor industry soldering connections using BGAs (Ball Grid Arrays) are widespread. Most prominent examples are the mounting of microprocessors.The only way to ensure this is a one hundred percent inspection, where each solder ball must be measured three-dimensionally.
Online testing of fibers can be a challenge for measurement technology providers. Together with industrial partners, the staff of the Fraunhofer IGCV has succeeded in reliably detecting fiber defects in production. Within the current project AirCarbon III, the Fraunhofer IGCV conducts research with AI in fiber technology.
The allPIXA pro, allPIXA wave and allPIXA evo camera can be used to trigger up to four different flash controller channels synchronized to its line acquisition. This can be used to acquire several images with different illumination geometries and/or colors (white, red, green, UV, IR) simultaneously in only one scan by line-multiplexing.
Active Inspection - a leading US system integrator for image processing systems - has developed an inspection system for bearings based on Chromasens' 3DPIXA 3D stereo line scan camera that is characterized by high flexibility and high speed.
Connectors are indispensable in electronics. For a long time now, they can only be economically produced on fully automated production lines with an integrated 100% quality check. Eberhard AG achieves this quality goal by switching to a one-step contactless test method with 3D line scan cameras.
3D image capturing system for on-track train inspection. Setting the direction. In view of ever more complex railway networks and increasingly shorter cycles, the assurance of a fault-free function of railway vehicles is the highest priority of railway operators. The implementation of new measuring methods such as high-precision 3D image capturing systems offers new strategies for innovative maintenance concepts.
Miniaturisation in the field of semiconductor technology proceeds unimpeded. The development of increasingly smaller components and integrated circuits requires not only extremely precise production processes, but also new, innovative methods of quality control. The use of high-resolution 3D line scan cameras is one method.